August 1950 Fujimi Abrasives was founded and started production of synthetic precision abrasive commenced
March 1953 Fujimi Abrasives Manufacturing Co., Ltd., established
1957 Supplied lapping abrasives for germanium semiconductor substrates for Tokyo Tsushin Kogyo, the predecessor of Sony Corporation.
July 1959 Moved headquarters to current location. Began manufacturing high-purity aluminum for vacuum tube and transistor insulators.
1960 Started production of FR polishing material (Fujimi Remi Rocks — cerium oxide) for optical and sheet glass
June 1960 Established the Tokyo Technology Center in Kawasaki City (Kanagawa Prefecture)
January 1961 Began manufacturing FS polish for germanium wafers.
July 1967 Announced the development of GLANZOX polish for silicon wafers.
May 1970 Commenced operations at the Inazawa Plant.
1971 Developed “FDP” for grinding optical lenses
1974 Developed the “GLANZOX” series of polishing materials for silicon wafers
1975 Launched the “INSEC” series of polishing materials for GaAs wafers
January 1977 Began manufacturing POLIPLA plastic lens polishing compounds.
1978 Closed the Tokyo Technology Center
October 1980 Head office building completed
1981 Developed the “COMPOL” series
1983 Developed the “MEDIPOL-N” series of polishing materials for hard disc drives
June 1984 Incorporated FUJIMI CORPORATION in Illinois, U.S.A.
January 1985 Commenced operations at the Kakamigahara Plant.
1987 Launched the “FPW-E” series of precision grinding stones for silicon wafers
May 1988 Incorporated FUJIMI AMERICA Inc. in Oregon, U.S.A.
September 1988 Developed GLANZOX-3900 ultrahigh-purity polishing compound for silicon wafers.
November 1990 Developed the DISKLITE series, the first polishing compounds developed especially for memory disks.
October 1991 FUJIMI Abrasives merged three domestic affiliates and was renamed FUJIMI INCORPORATED.
October 1993 Developed the DIATEC-GTX series of disk texturing compounds.
June-September 1994 Obtained ISO 9002 certification for all production facilities in Japan and the U.S.A.
April 1995 Listed Fujimi's shares on the over-the-counter market. (now listed on JASDAQ)
FUJIMI-MICRO TECHNOLOGY SDN. BHD's. in Malaysia. Established the joint venture. Developed the PLANERLITE series of CMP slurries.
October 1996 Commenced operations at FUJIMI AMERIACA's Tualatin Plant in Oregon, U.S.A.
December 1996 Commenced operations at the Kakamihigashimachi Plant.
January 1999 Commenced operations at new logistics center.
March 1999 Obtained ISO 9001 for all production facilities in Japan.
November 1999 Made FUJIMI CORPORATION a wholly owned subsidiary.
March 2000 Obtained ISO 14001 certification for all production facilities in Japan.
May 2000 Commenced operations at the No.2 Kakamihigashimachi Plant
(Surface Technology Plant).
September 2000 Started R&D activities at new R&D Center.
October 2000 FUJIMI-MICRO TECHNOLOGY SDN. BHD's. Kulim Plant starts operations in Malaysia.
December 2000 Develops the PLANERLITE-7000,new slurry series for Cu CMP.
January 2001 Introduces the SURPREX-W2010X,new WC cermet thermal spraying composites with enhanced impact resistance.
March 2002 FUJIMI AMERICA INC. won a Preferred Quality Supplier award from Intel.
October 2002 Succeeded with world's first ultrafine-grain thermal spray system employing a high velocity oxy fuel (HVOF) process.
March 2003 ISO 14001 certification obtained for FUJIMI-MICRO TECHNOLOGY SDN. BHD. Parent company and FUJIMI AMERICA INC. received Preferred Quality Supplier Award from Intel Corporation.
July 2003 FUJIMI AMERICA INC. and FUJIMI CORPORATION merge under the name FUJIMI CORPORATION.
January 2004 FUJIMI EUROPE LIMITED (England) and FUJIMI EUROPE GmbH (Germany) start operations
March 2004 FUJIMI CORPORATION receives Intel's Prestigious Supplier Continuous Quality Improvemennt award.
October 2005 Established an office in Taiwan
February 2007 Listed Fujimi's shares on the Tokyo Stock Exchange First Section and Nagoya Stock Exchange First Section.
March 2007 Withdraw from the list of JASDAQ securities exchange.
April 2007 Head Quarter Plant changes its name to Biwajima Plant.
May 2007 Established an office in Shanghai.
May 2008 Commenced operations at Kakamihigashimachi Plant No.2.
July 2008 FUJIMI CORPORATION received World Class Supplier Pathfinder Award 2007 from AMD.
October 2008 Established an office in Korea.
November 2009 Succeded in developing “angular nano-aluminium” as an abrasive material.
March 2010 Succeeded with world's first Novel tungsten carbide powders applicable to low temperature spray process of 500 deg C.
September 2010 FUJIMI EUROPE LIMITED (England) is transferred to FUJIMI EUROPE GmbH (Germany)
April 2011 Obtained JIS Q 9100 quality management certification for aircraft, space and defense (for thermal spray materials).
August 2011 Established FUJIMI TAIWAN LIMITED in Taiwan.
January 2013 Established FUJIMI KOREA LIMITED in Korea.
December 2013 Parent company receives Excellent Performance Award from TSMC
January 2015 Established FUJIMI SHENZHEN TECHNOLOGY. CO., LTD. in China.
March 2015 FUJIMI CORPORATION receives Preferred Quality Supplier Award from Intel Corporation.
March 2016 FUJIMI CORPORATION receives Preferred Quality Supplier Award from Intel Corporation. - two consecutive years
March 2017 FUJIMI CORPORATION receives Supplier Continuous Quality Improvement Award from Intel Corporation.