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In producing these semiconductor
devices, the surface of the semiconductor wafer, most typically
silicon, or a compound semiconductor, must be precisely lapped.
The most suitable material to process the surface of semiconductor
elements is the product harvested from Fujimi's technology:
the precision lapping powder FO.
FO is an alumina-based precision lapping powder, made using
carefully selected materials, and undergoing Fujimi's own unique
processing to produce a powder with special particle shape and
hardness. Produced under the strictest quality control, FO provides
constant, stable lapping capability, with no scratching on the
surface of the material being lapped. This being the case, not
only is FO effective with semiconductor wafers, but it also
possesses superior capabilities in the processing of lenses,
prisms, and other glassware used for optical applications. Thus,
FO can be used with complete confidence, for high value-added
workpieces. |
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