|
 |
|
|
|
|
With the increasing integration
of semiconductor devices and the larger size of wafers, a silicon
surface that is free of damage, haze and heavy metal contamination,
as well as flat, and nanotopographically mirror-like is
essential. Fujimi's GLANZOX series was developed to meet such
requirements. GLANZOX polish consists of colloidal silica dispersed
in a liquid composed of special ingredients. This product results
in an almost perfectly polished surface. In response to the
recent demand for considerable reductions in the metal impurities
that affect device characteristics, higher grades of polish
containing ultrapure colloidal silica have been developed. |
 |
|
|
The PLANERLITE series of
polishing slurries is intended for use in chemical mechanical
planarization (CMP), a key planarization process in the fabrication
of high-density ultra large scale integration (ULSI) devices.
It has been developed under the basic concepts of high purity,
high removal rate, high dispersion and scratch-free performance.
・PLANERLITE-4000 series
This polishing slurry is designed for use on SiO2 films (inter-layer
dielectric, shallow trench isolation), and is based on ultrapure
colloidal silica or fumed silica.
・PLANERLITE-6000 series
This polishing slurry is designed for use with polisilicon.
There is a variety of types available, either polishing slurry
based on ultrapure colloidal silica or rinsing agent with special
additives which keeps the post-polishing wafer surface hydrophilic.
・PLANERLITE-7000 series
This polishing slurry is designed specifically for copper (Cu)
metallization in the damascene process. Based on ultrapure colloidal
silica with special additives, it delivers high copper removal
rate, with excellent selectivity to barrier metal.
・PLANERLITE-8000 series
This polishing slurry is specifically for the barrier metals and comprises two varreties.
one that polishes the ILD and one that does not. |
|
| INSEC |
| Compound Semiconductor Polish |
|
|
|
The INSEC series is a range
of polishing agents for high-precision mirror-finishing of a
compound semiconductor crystal through the mechanochemical process.
This series has a wide variety of products, including: FP (first-stage
polishing agent); NIB (final polishing agent) for gallium arsenide
(GaAs) wafers; P (final polishing agent) for gallium phosphide
(GaP) wafers; SP, an agent used exclusively for double-sided
polishing of GaAs wafers, and IPP, which is an agent used for
first polishing of indium phosphide (InP) wafers. |
|
|
|
