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As the leading name in synthetic precision abrasives, Fujimi supports
the advanced electronic industry through its aggressive
development of polishing and abrasive compounds for various
electronic components, such as silicon wafers, semiconductor
devices and hard disks. Also, we are seeking to enhance the
development of thermal spray materials and the fundamental
technology development function, which is core to our growth.
We are working to strengthen our technology-based new business
and topics research and planning function.
Silicon Wafer Compounds
In accordance with rising demand for 300mm silicon wafers
and shrinking design rules, demand is increasing for synthetic
precision abrasives that are (1) flat, (2) free from defects and
(3) smooth, and that (4) minimize contamination from trace
metals and (5) improve manufacturing. We are focused on
abrasive grain refinement to improve the processing accuracy
and yield rate for lapping and silicon wafer slicing abrasives,
which are also required for high-performance flatness and
improved manufacturing.
The demand for flat, defect-free, smooth and uncontaminated
polishing compounds used in the finishing process
are growing stronger. We are developing polishing compounds
that will reduce nano defects and achieve the level
of smoothness required in polishing next-generation wafers
for 22nm devices, as well as polishing compounds that
achieve atomic level smoothness. Fujimi is also engaged in
the development of abrasives and additive technologies for
high-speed polishing compounds, which are linked with productivity
increases.
Device CMP
Semiconductor device manufacturers have commenced
mass production of LSIs with 32nm technology nodes, and a
shift toward devices with even finer 22nm line widths is now
underway. This generation of devices is drawing attention
as it will mark the first commercialization of 3D transistors,
as well as employing metal gate and other technologies.
The manufacture of these devices requires numerous CMP
processes, employing polishing compounds from other applications.
In addition to polishing compounds for copper and
barrier materials, to meet the demands imposed by new LSI
structures we offer compounds for aluminum, polysilicon,
interlayer dielectric (ILD) and tungsten. As well as performance
enhancements such as nanometric wiring surface planarity
and absence of defects, such miniature devices require
further improvements in terms of productivity and cost. In
addition to its abrasives, filtration and classification, and
chemicals technologies, Fujimi has the polishing equipment
and surface testing devices required to produce leading-edge
devices, and we are pursuing developments in response to
customers’ needs.
Compounds for Hard Disks
We continue to develop glass disk polishing compounds, as
this is seen as an area of future growth. In addition, Fujimi is
focusing on the development of high-performance polishing
compounds for next-generation hard disks, which have greater
storage volume and higher density. As with semiconductors,
customers are currently demanding hard disk substrates
that ensure fewer defects and leave fewer residues. We are
developing products to meet these needs.
Specialty Materials
In response to growing environmental and energy-related
demand, we are working assiduously to develop polishing
and abrasive compounds using in the production of LEDs
and next-generation power devices. These products are slated
for rapid market expansion, with market attention focusing
on their effects in CO2 reduction and energy savings.
Therefore, we are striving to shorten the time required for
processing brittle sapphire substrates for LEDs and gallium
nitride (BaN) and silicon carbide (SiC) substrates for nextgeneration
power devices, without damaging the substrates.
Owing to difficulties in securing supplies of rare earth materials
and to offset rising costs, we are working on a polishing
compound for glass substrates to serve as an alternative to
cerium oxide.
We are also developing functional materials such as angular
nanoalumina, whose particle characteristics lend themselves
to use in lens polishing.
In planning its new product and development themes,
Fujimi’s R&D planning section takes a two-pronged approach
to determining development targets, as it looks for fields with
development potential for the Company’s core technologies,
as well as promising new technologies and markets.
Core Technologies, Production Technologies
This section focuses on reinforcing Fujimi’s strengths in core
technologies. By promoting the development of technologies
mainly involving (1) filtration and classification, (2) abrasives
and (3) chemicals, the section will accelerate product development,
target greater functionality and help expand the
Company’s operations into new fields of business.
Thermal Spray Materials
We provide cermet materials for manufacturing equipment
and aircraft parts, and are expanding our offerings of thermal
spray materials used to form high-value-added coatings
on electronic devices and LCD production equipment, and
this market is expected to expand in scale. We are stepping
up our development of thermal spray materials in response
to robust recent demand for low-temperature sprays (cold
sprays and warm sprays) employed in new thermal spray
methods.
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