“PLANERLITE” has been developed as a high-purity, high dispersion, scratch-free CMP polishing material with superior processing efficiency.
It is an effective material designed for high-level surface processing on wafers containing multilayer circuits.
|PLANERLITE 4000 Series||Slurries for oxide films|
|PLANERLITE 5000 Series||Slurries for W|
|PLANERLITE 6000 Series||CMP slurries for Poly-Si|
|PLANERLITE 6500 Series||Rinse slurries for particle removal on Poly-Si film|
|PLANERLITE 7000 Series||Slurries for Cu|
|PLANERLITE 8000 Series||Polishing slurries for Cu/Ta and other barrier films|
Fujimi handles slurry materials designed for a variety of purposes. Please feel free to ask for further information.
|Use||Product name and description|
|HKMG (High-k/Metal gate)
High dielectric constant film/metal gate
In addition to the leading edge device technologies on the left, we also develop slurry ideally suited to customer needs.
Please contact us for further details.
|TSV (through-silicon via)|
|Polishing slurry for resins|
|New materials (for III-V materials, Co, SiC, and Si-Ge polishing)|