Metal products

We offer a range of products for polishing machinery parts, various precision parts, and metal molds. Our offering is designed to meet your needs.

Plastic products

We offer a range of lapping and polishing products for resin products.

Glass

Crystal oscillators

We produce lapping and polishing materials for the liquid crystals contained in the oscillators used to transmit waves by mobile phones and other telecommunication devices.

SAW filters

SAW filters are used in mobile phones and other telecommunication devices to pick up electrical signals on a particular frequency. Substrate material used is LiNbO3 and LiTaO3. Fujimi lapping and polishing products are used on these substrate materials to produce the desired finish.

Photomasks

We polish the photomasks used to transcribe circuitry on the semiconductors used in electronic components.

Sapphire substrate

Sapphire is used as substrate material for LEDs, which use 1/10th the electricity and have a longer product life than incandescent light bulbs.
Sapphire is a hard, brittle material that is extremely difficult to process. A mirror finish using CMP is needed in the final stage to produce the epi-ready surface needed for the light emitting layers.
The COMPOL series deliver uniform granulation and excellent diversity, and a damage free polishing surface is realized by eliminating gell substances and other impurities.

GaN substrate

Devices containing GaN are know to exhibit excellent properties for high intensity LEDs, but there are numerous issues remaining for processing GaN substrate.
The COMPOL series delivers uniform granulation and excellent diversity, and a damage free polishing surface is realized by eliminating gell substances and other impurities.

SiC substrate

Single-crystal SiC substrate is a promising material for LEDs to achieve effective use of power in a low carbon society. SiC, however, is an extremely hard and brittle material that is very hard to process, and the demands on the polishing process to produce a mirror finish are challenging.
The COMPOL series delivers uniform granulation and excellent diversity, and a damage free polishing surface is realized by eliminating gell substances and other impurities.

III-V group compound substrate

GaAs, GaP, and InP group compound semiconductors are mainly used for infrared and visible light LED substrates. Fujimi offers a range of lapping and polishing products for the surface processing of these substrates.

Chassis

We carry a range of materials to produce the coated abrasives and polishing materials used to polish automobile chassis.

Drive-related parts

We offer a range of particles for use on grind wheels for polishing engines, shafts, gears, and bearings.

Metal products

We offer a range of products for polishing machinery parts, various precision parts, and metal molds. Our offering is designed to meet your needs.

Plastic products

We offer a range of lapping and polishing products for plastic products.

Brake pads

The WA and GC produced by Fujimi meet the heat dispersion and wear resistance required for filler material in brake pads.

Composite plating

GC particles are used as filler material to increase wear resistance on the inner wall of engine cylinders.

Glass lenses

We offer a range of lapping, polishing, and Diamond products for polishing the optical lenses used in digital cameras.

Plastic lenses

POLIPLA is a compound type polishing product designed for plastic lenses. It is produced from high purity alumina that is evenly distributed and a special liquid with PH balanced between 3.0-4.0, and generates high polishing rates and fine finished surfaces.

GaN substrate

The GaN used in power semiconductors exhibit excellent properties for high power output and high frequency devices, but there are numerous issues remaining for processing GaN substrate.
The COMPOL series delivers uniform granulation and excellent diversity, and a damage free polishing surface is realized by eliminating gell substances and other impurities.

SiC substrate

Single-crystal SiC substrate is a promising material for power semiconductors to achieve efficient use of power in a low carbon society. SiC, however, is an extremely hard and brittle material that is very hard to process, and the demands on the polishing process to produce a mirror finish are challenging.
The COMPOL series delivers uniform granulation and excellent diversity, and a damage free polishing surface is realized by eliminating gell substances and other impurities.

III-V group compound substrate

In addition to LEDs, GaAs, GaP, and InP are increasingly used as substrate material for high-frequency devices and sensors. Fujimi offers a range of lapping and polishing products for the surface processing of these substrates.

Metal products

We offer a range of products for polishing machinery parts, various precision parts metal molds. Our offering is designed to meet your needs.

Plastic products

We offer a range of lapping and polishing products for plastic products.