- August 1950
- Fujimi Abrasives was founded and started production of synthetic precision abrasive commenced
- March 1953
- Fujimi Abrasives Manufacturing Co., Ltd., established
- 1957
- Supplied lapping abrasives for germanium semiconductor substrates for Tokyo Tsushin Kogyo, the predecessor of Sony Corporation.
- July 1959
- Moved headquarters to current location. Began manufacturing high-purity aluminum for vacuum tube and transistor insulators.
- 1960
- Started production of FR polishing material (Fujimi Remi Rocks — cerium oxide) for optical and sheet glass
- June 1960
- Established the Tokyo Technology Center in Kawasaki City (Kanagawa Prefecture)
- January 1961
- Began manufacturing FS polish for germanium wafers.
- July 1967
- Announced the development of GLANZOX polish for silicon wafers.
- May 1970
- Commenced operations at the Inazawa Plant.
- 1971
- Developed “FDP” for grinding optical lenses
- 1974
- Developed the “GLANZOX” series of polishing materials for silicon wafers
- 1975
- Launched the “INSEC” series of polishing materials for GaAs wafers
- January 1977
- Began manufacturing POLIPLA plastic lens polishing compounds.
- 1978
- Closed the Tokyo Technology Center
- October 1980
- Head office building completed
- 1981
- Developed the “COMPOL” series
- 1983
- Developed the “MEDIPOL-N” series of polishing materials for hard disc drives
- June 1984
- Incorporated FUJIMI CORPORATION in Illinois, U.S.A.
- January 1985
- Commenced operations at the Kakamigahara Plant.
- 1987
- Launched the “FPW-E” series of precision grinding stones for silicon wafers
- May 1988
- Incorporated FUJIMI AMERICA Inc. in Oregon, U.S.A.
- September 1988
- Developed GLANZOX-3900 ultrahigh-purity polishing compound for silicon wafers.
- November 1990
- Developed the DISKLITE series, the first polishing compounds developed especially for memory disks.
- October 1991
- FUJIMI Abrasives merged three domestic affiliates and was renamed FUJIMI INCORPORATED.
- October 1993
- Developed the DIATEC-GTX series of disk texturing compounds.
- June-September 1994
- Obtained ISO 9002 certification for all production facilities in Japan and the U.S.A.
- April 1995
- Listed Fujimi's shares on the over-the-counter market. (now listed on JASDAQ)
FUJIMI-MICRO TECHNOLOGY SDN. BHD's. in Malaysia. Established the joint venture.
Developed the PLANERLITE series of CMP slurries.
- October 1996
- Commenced operations at FUJIMI AMERIACA's Tualatin Plant in Oregon, U.S.A.
- December 1996
- Commenced operations at the Kakamihigashimachi Plant.
- January 1999
- Commenced operations at new logistics center.
- March 1999
- Obtained ISO 9001 for all production facilities in Japan.
- November 1999
- Made FUJIMI CORPORATION a wholly owned subsidiary.
- March 2000
- Obtained ISO 14001 certification for all production facilities in Japan.
- May 2000
- Commenced operations at the No.2 Kakamihigashimachi Plant
(Surface Technology Plant).
- September 2000
- Started R&D activities at new R&D Center.
- October 2000
- FUJIMI-MICRO TECHNOLOGY SDN. BHD's. Kulim Plant starts operations in Malaysia.
- December 2000
- Develops the PLANERLITE-7000,new slurry series for Cu CMP.
- January 2001
- Introduces the SURPREX-W2010X,new WC cermet thermal spraying composites with enhanced impact resistance.
- March 2002
- FUJIMI AMERICA INC. won a Preferred Quality Supplier award from Intel.
- October 2002
- Succeeded with world's first ultrafine-grain thermal spray system employing a high velocity oxy fuel (HVOF) process.
- March 2003
- ISO 14001 certification obtained for FUJIMI-MICRO TECHNOLOGY SDN. BHD. Parent company and FUJIMI AMERICA INC. received Preferred Quality Supplier Award from Intel Corporation.
- July 2003
- FUJIMI AMERICA INC. and FUJIMI CORPORATION merge under the name FUJIMI CORPORATION.
- January 2004
- FUJIMI EUROPE LIMITED (England) and FUJIMI EUROPE GmbH (Germany) start operations
- March 2004
- FUJIMI CORPORATION receives Intel's Prestigious Supplier Continuous Quality Improvemennt award.
- October 2005
- Established an office in Taiwan
- February 2007
- Listed Fujimi's shares on the Tokyo Stock Exchange First Section and Nagoya Stock Exchange First Section.
- March 2007
- Withdraw from the list of JASDAQ securities exchange.
- April 2007
- Head Quarter Plant changes its name to Biwajima Plant.
- May 2007
- Established an office in Shanghai.
- May 2008
- Commenced operations at Kakamihigashimachi Plant No.2.
- July 2008
- FUJIMI CORPORATION received World Class Supplier Pathfinder Award 2007 from AMD.
- October 2008
- Established an office in Korea.
- November 2009
- Succeded in developing “angular nano-aluminium” as an abrasive material.
- March 2010
- Succeeded with world's first Novel tungsten carbide powders applicable to low temperature spray process of 500 deg C.
- September 2010
- FUJIMI EUROPE LIMITED (England) is transferred to FUJIMI EUROPE GmbH (Germany)
- April 2011
- Obtained JIS Q 9100 quality management certification for aircraft, space and defense (for thermal spray materials).
- August 2011
- Established FUJIMI TAIWAN LIMITED in Taiwan.
- January 2013
- Established FUJIMI KOREA LIMITED in Korea.
- December 2013
- Parent company receives Excellent Performance Award from TSMC
- January 2015
- Established FUJIMI SHENZHEN TECHNOLOGY. CO., LTD. in China.
- March 2015
- FUJIMI CORPORATION receives Preferred Quality Supplier Award from Intel Corporation.
- April 2015
- Established the Advanced Technology Research Center.
- March 2016
- FUJIMI CORPORATION receives Preferred Quality Supplier Award from Intel Corporation. - two consecutive years
- March 2017
- FUJIMI CORPORATION receives Supplier Continuous Quality Improvement Award from Intel Corporation.
- March 2018
- FUJIMI CORPORATION receives Preferred Quality Supplier Award from Intel Corporation.
- March 2019
- FUJIMI CORPORATION receives Preferred Quality Supplier Award from Intel Corporation.
- March 2020
- FUJIMI CORPORATION receives Supplier Continuous Quality Improvement Award from Intel Corporation.
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